Aluminum-based copper clad laminate is a kind of metal circuit board material, which is composed of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers:
Cireuitl.Layer circuit layer: It is equivalent to the copper clad board of ordinary PCB, and the copper foil thickness of the circuit is loz to 10oz.
DielcctricLayer insulation layer: The insulation layer is a layer of low thermal resistance and heat conduction insulating material.
BaseLayer base layer: is a metal substrate, generally aluminum or copper can be selected. Aluminum-based copper clad laminates and traditional epoxy glass cloth laminates, etc.
The circuit layer (that is, copper foil) is usually etched to form a printed circuit, which connects the various components of the element. In general, the circuit layer requires a large current carrying capacity, so a thicker copper foil should be used. 280μm; thermal insulation layer is the core technology of aluminum substrate. It is generally composed of special polymers filled with special ceramics. It has small thermal resistance, excellent viscoelastic properties, and has the ability to resist thermal aging and can withstand mechanical and thermal stress.
The thermal insulation layer of the high-performance aluminum substrate uses this technology to make it have excellent thermal conductivity and high-strength electrical insulation performance; the metal base layer is the supporting member of the aluminum substrate, which requires high thermal conductivity, generally an aluminum plate , Can also use copper plate (copper plate can provide better thermal conductivity), suitable for conventional mechanical processing such as drilling, punching and cutting. PCB materials have unparalleled advantages compared with other materials. Suitable for surface mount SMT art of power components. No heat sink is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the good insulation performance and mechanical performance.